1. It can realize high-speed cutting, and the cutting speed can be increased to twice the original, and the time consumption is naturally reduced. It can complete more work per unit of time, which is its biggest advantage. 2. Environmentally friendly production, the process of the steel wire only needs water or water-based cooling and cleaning fluid, which truly realizes environmentally friendly production and manufacturing. However, there are still many deficiencies in the diamond wire technology, mainly: (1). The cost is high. This is a relatively new technology and has not been popularized. The main diamond wire depends on imports. The supply of diamond wire from domestic companies is still relatively small. So the price is relatively high. (2). The wire is too thick, resulting in a large loss of silicon. The loss of the silicon wafer is directly related to the thickness of the cutting line. The thicker the wafer, the more natural loss. The mainstream cutting line is ultra-fine cutting steel wire with a diameter of about 100 microns. In practical applications, the diameter of the diamond wire is about 250 microns, which is more than twice that of the ultra-fine cut steel wire. (3). There will be cut marks which will lead to low conversion efficiency of crystalline silicon cells. Therefore, diamond wire is mainly used in the field of rough processing of silicon wafers, for example, it has been used in the preparation of silicon ingots. In the field of finer slicing, ultra-fine cutting steel wire is still used.